TSMC has partnered with Arizona-based Amkor Technology to bring advanced chip packaging and testing capabilities to the United States for the first time. As part of the agreement, TSMC will contract Amkor’s turnkey packaging and testing services at their planned $2 billion chip packaging and testing facility in Peoria, Arizona. Advanced packaging accounts for about 8 percent of the semiconductor market, but that share is expected to double by 2030, exceeding $96 billion.